电子封装用环氧树脂固化温度与应变的三维有限元模拟
Three-dimensional finite element simulation of temperature and strain in epoxy resin used to electronic packaging during curing

DOI: 10.13801/j.cnki.fhclxb.20181116.001

Keywords: 电子封装,环氧树脂,固化过程,有限元分析,光纤布拉格光栅(FBG)
electronic packaging,epoxy resin,curing process,finite element analysis,fiber Bragg grating(FBG)

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