%0 Journal Article
%T 电子封装用环氧树脂固化温度与应变的三维有限元模拟<br>Three-dimensional finite element simulation of temperature and strain in epoxy resin used to electronic packaging during curing
%A 康峻铭
%A 孙亮亮
%A 王继辉
%A 李小阳
%A 杨鹏
%J 复合材料学报
%D 2019
%R 10.13801/j.cnki.fhclxb.20181116.001
%K 电子封装
%K 环氧树脂
%K 固化过程
%K 有限元分析
%K 光纤布拉格光栅(FBG)<br>electronic packaging
%K epoxy resin
%K curing process
%K finite element analysis
%K fiber Bragg grating(FBG)
%U http://fhclxb.buaa.edu.cn/CN/abstract/abstract14592.shtml