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- 2015
SnAgCu-nano Al钎料Anand本构关系及焊点可靠性
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Abstract:
研究了含纳米0.1 wt.%Al颗粒SnAgCu无铅钎料Anand本构关系，将本构关系应用于有限元模拟，分析FCBGA器件SnAgCu-nano Al焊点的应力-应变响应。结果表明，在不同的温度和应变速率的条件下，可以采用非线性数据拟合方法得到SnAgCu-nano Al钎料的Anand本构方程的9个参数值。结合Anand本构模型，采用有限元法计算焊点应力-应变，发现FCBGA器件SnAgCu-nano Al焊点应力-应变分布和焊点阵列有明显的关系，最大的应力-应变集中于拐角焊点；SnAgCu-nano Al焊点的应力-应变值明显低于SnAgCu焊点，证明纳米Al可以提高SnAgCu焊点的可靠性。
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