高温下不同银含量微电子胶连点的力学性能及膨胀系数不匹配热应力
High-temperature mechanical properties and thermal mismatch stress of conductive adhesive with different silver contents in flip chip packaging

DOI: 10.13801/j.cnki.fhclxb.20170308.002

Keywords: 导电胶,微压入,力学性能,数值模拟,热应力
conductive adhesive,micro-indentation,mechanical properties,numerical simulation,thermal stress

Full-Text   Cite this paper   Add to My Lib

Abstract:

References

[1]	刘勇, 梁利华, 曲建民. 微电子器件及封装的建模与仿真[M]. 北京:科学出版社, 2010. LIU Y, LIANG L H, QU J M. Microelectronic devices and packaging modeling and simulation[M]. Beijing:Science Press, 2010(in Chinese).
[2]	JONG W R, PENG S H, TSAI H C. Characteristics of a new-type anisotropic conductive film joints during the bonding process[J]. International Communications in Heat and Mass Transfer, 2010, 37(5):506-513.
[3]	TEE T Y, ZHONG Z W. Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages[J]. Microelectronics Reliability, 2004, 44(12):1957-1965.
[4]	马缓, 齐暑华. 高热导率Ag-AIN/聚丙烯酸酯导电胶黏剂的制备与性能[J]. 复合材料学报, 2016, 33(3):558-563. MA H, QI S H. Preparation and properties of Ag-AIN/acrylate electrically conductive adhesives with high thermal conducticity[J]. Acta Materiae Compositae Sinica, 2016, 33(3):558-563(in Chinese).
[5]	郑涛, 王洪, 杨旭明. 银粉-环氧树脂导电胶的研制[J]. 塑料工业, 2016, 44(1):133-136. ZHENG T, WANG H, YANG X M. Development of silver-epoxy resin electro-conductive adhesive[J]. China Plastics Industry, 2016, 44(1):133-136(in Chinese).
[6]	夏静, 向雄志, 曾其海, 等. 镀银石墨/有机硅导电胶的耐热性能研究[J]. 中国胶黏剂, 2014, 23(7):373-376. XIA J, XIANG X Z, ZENG Q H, et al. Study on heat resistance of silver-plating graphite/silicone conductive adhesive[J]. China Adhesives, 2014, 23(7):373-376(in Chinese).
[7]	吴红丽, 张伟. 二氧化硅对碳黑/环氧树脂复合材料渗透特性的影响[J]. 材料工程, 2010(4):46-50. WU H L, ZHANG W. Effect of silica on percolation characteristics of carbon black/epoxy resin composites[J]. Journal of Materials Engineering, 2010(4):46-50(in Chinese).
[8]	张博, 党智敏. 低温快速固化环氧导电胶的制备与性能[J]. 复合材料学报, 2011, 28(5):34-40. ZHANG B, DANG Z M. Preparation and performance of epoxy resin conductive adhesive with fast-curing feature at low temperature[J]. Acta Materiae Compositae Sinica, 2011, 28(5):34-40(in Chinese).
[9]	王长宏, 朱冬生. 电子封装热管理的热电冷却技术研究进展[J]. 电子元件与材料, 2008, 27(11):4-7. WANG C H, ZHU D S. Research progress on thermoelectric cooling technology applied in electronic packaging thermal management[J]. Electronic Components and Materials, 2008, 27(11):4-7(in Chinese).
[10]	陶宇, 夏艳平, 张国庆, 等. 填料长径比对导电胶渗流阈值的影响[J]. 复合材料学报, 2016, 27(6):213-217. TAO Y, XIA Y P, ZHANG G Q, et al. Influence of slenderness ratio on the percolation threshold of conductive adhesives[J]. Acta Materiae Compositae Sinica, 2016, 27(26):213-217(in Chinese).
[11]	刘培生, 杨龙龙, 刘亚鸿, 等. 导电胶在倒装芯片互连结构中的应用进展[J]. 电子元件与材料, 2015, 34(9):13-18. LIU P S, YANG L L, LIU Y H, et al. Application of conductive adhesive in flip chip interconnection structure[J]. Electronic Components and Materials, 2015, 34(9):13-18(in Chinese).
[12]	吴嘉杰. 测试温度范围对环氧树脂平均线膨胀系数的影响[J]. 理化检验(物理分册), 2016, 52(5):291-294. WU J J. Influence of testing temperature range on average coefficient of linear expansion of epoxy resins[J]. Physical Testing and Chemical Analysis Part A:Physical Testing, 2016, 52(5):291-294(in Chinese).
[13]	OLIVER W C, PHARR G M. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments[J]. Journal of Materials Research, 1992, 7(6):1564-1583.
[14]	PHARR G M, OLIVER W C, BROTZEN F R. On the generality of the relationship among contact stiffness, contact area, and elastic modulus during indentation[J]. Journal of Materials Research, 1992, 7(3):613-617.
[15]	OLIVER W C, PHARR G M. Measurement of hardness and elastic modulus by instrumented indentation:Advance in understanding and refinements to methodology[J]. Journal of Materials Research, 2004, 19(1):3-20.
[16]	FISCHER-CRIPPS A C. Nanoindention[M]. New York:Spring-Verlag, 2002.
[17]	李志远, 钱乙余, 张九海. 先进连接方法[M]. 北京:机械工业出版社, 2000. LI Z Y, QIAN Y Y, ZHANG J H. Advanced connection method[M]. Beijing:Mechanical Industry Press, 2000(in Chinese).
[18]	卢龙飞, 齐署华, 马缓, 等. 高性能导电胶研究新进展[J]. 中国胶黏剂, 2016, 2(4):230-234. LU L F, QI S H, MA H, et al. New research progress of electrically conductive adhesives with high properties[J]. China Adhesives, 2016, 2(4):230-234(in Chinese).
[19]	VRIES H D, DELFT J V, SLOB K. SMT-compatibility of adhesive flip chip on foil interconnections with 40-/spl mu/m pitch[J]. IEEE Transactions on Components and Packaging Technologies, 2005, 28(3):499-505.
[20]	GUAN Y L, CHEN X, LI F Q, et al. Study on the curing process and shearing tests of die attachment by Ag-epoxy electrically conductive adhesive[J]. International Journal of Adhesion & Adhesives, 2010, 30(2):80-88.
[21]	CHENG H C, HSIEH K Y, CHEN K M. Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology[J]. Microelectronics Reliability, 2011, 51(4):826-836.
[22]	HWANG J S, YIM M J, PAIK K W. Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application[J]. Microelectronics Reliability, 2008, 48(2):293-299.
[23]	RIZVI M J, BAILEY C, LU H. Failure mechanisms of ACF joints under isothermal ageing[J]. Microelectronics Journal, 2008, 39(9):1101-1107.

Full-Text