%0 Journal Article
%T 高温下不同银含量微电子胶连点的力学性能及膨胀系数不匹配热应力<br>High-temperature mechanical properties and thermal mismatch stress of conductive adhesive with different silver contents in flip chip packaging
%A 吉新阔
%A 肖革胜
%A 刘二强
%A 杨雪霞
%A 树学峰
%J 复合材料学报
%D 2017
%R 10.13801/j.cnki.fhclxb.20170308.002
%K 导电胶
%K 微压入
%K 力学性能
%K 数值模拟
%K 热应力&lt
%K br&gt
%K conductive adhesive
%K micro-indentation
%K mechanical properties
%K numerical simulation
%K thermal stress
%U http://fhclxb.buaa.edu.cn/CN/abstract/abstract13830.shtml