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- 2017
SiC颗粒-SiC晶须混杂填料/双马来酰亚胺树脂导热复合材料的制备与性能
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Abstract:
以双马来酰亚胺树脂（BMI）为树脂基体，二烯丙基双酚A（DABA）为增韧剂，γ-缩水甘油醚氧丙基三甲氧基硅烷（KH-560）表面改性的SiC颗粒-SiC晶须（SiCP-SiCW）为复配导热填料，浇注成型制备SiCP-SiCW/BMI导热复合材料，分析研究SiC形状、用量、质量比及表面改性对SiCP-SiCW/BMI导热复合材料的导热性能、介电性能、力学性能和热性能的影响。结果表明，当改性SiCP-SiCW用量为40wt%且SiCP∶SiCW质量比为1∶3时，SiCP-SiCW/BMI导热复合材料具有最佳的综合性能，导热系数λ为1.125 W（m·K）-1，介电常数ε为4.12，5%热失重温度为427℃。 Functionalized SiC particle-SiC whisker (SiCP-SiCW) hybrid fillers by γ-glycidoxypropyltrimethoxysilane (KH-560) were performed to fabricate the functionalized SiCP-SiCW/bismaleimide (SiCP-SiCW/BMI) thermal conductivity composites,BMI as the polymeric matrix and diallylbisphenol A (DABA) as a toughening agent,respectively.Effects of the shape,content,compound and surface functionalization of SiC fillers on the thermal conductivities,dielectric & mechanical properties and thermal stabilities of the functionalized SiCP-SiCW/BMI thermal conductivity composites were investigated.The results show that the functionalized SiCP-SiCW/BMI thermal conductivity composite with 40wt% functionalized SiCP-SiCW(1:3,mass ratio) hybrid fillers exhibits the best comprehensive performance,the corresponding thermally conductive coefficient λ of 1.125 W (m·K)-1,dielectric constant ε of 4.12,and 5wt% thermal mass loss temperature of 427℃. 国家自然科学基金（51403175）
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