%0 Journal Article
%T SiC颗粒-SiC晶须混杂填料/双马来酰亚胺树脂导热复合材料的制备与性能<br>Preparation and properties of SiCP-SiCW hybrid fillers/bismaleimide thermal conductivity composites
%A 党婧
%A 刘婷婷
%J 复合材料学报
%D 2017
%R 10.13801/j.cnki.fhclxb.20160328.002
%X 以双马来酰亚胺树脂（BMI）为树脂基体，二烯丙基双酚A（DABA）为增韧剂，γ-缩水甘油醚氧丙基三甲氧基硅烷（KH-560）表面改性的SiC颗粒-SiC晶须（SiCP-SiCW）为复配导热填料，浇注成型制备SiCP-SiCW/BMI导热复合材料，分析研究SiC形状、用量、质量比及表面改性对SiCP-SiCW/BMI导热复合材料的导热性能、介电性能、力学性能和热性能的影响。结果表明，当改性SiCP-SiCW用量为40wt%且SiCP∶SiCW质量比为1∶3时，SiCP-SiCW/BMI导热复合材料具有最佳的综合性能，导热系数λ为1.125 W（m·K）-1，介电常数ε为4.12，5%热失重温度为427℃。 Functionalized SiC particle-SiC whisker (SiCP-SiCW) hybrid fillers by γ-glycidoxypropyltrimethoxysilane (KH-560) were performed to fabricate the functionalized SiCP-SiCW/bismaleimide (SiCP-SiCW/BMI) thermal conductivity composites,BMI as the polymeric matrix and diallylbisphenol A (DABA) as a toughening agent,respectively.Effects of the shape,content,compound and surface functionalization of SiC fillers on the thermal conductivities,dielectric & mechanical properties and thermal stabilities of the functionalized SiCP-SiCW/BMI thermal conductivity composites were investigated.The results show that the functionalized SiCP-SiCW/BMI thermal conductivity composite with 40wt% functionalized SiCP-SiCW(1:3,mass ratio) hybrid fillers exhibits the best comprehensive performance,the corresponding thermally conductive coefficient λ of 1.125 W (m·K)-1,dielectric constant ε of 4.12,and 5wt% thermal mass loss temperature of 427℃. 国家自然科学基金（51403175）
%K 双马来酰亚胺树脂
%K 二烯丙基双酚A
%K SiC颗粒
%K SiC晶须
%K 导热复合材料&lt
%K br&gt
%K bismaleimide
%K diallylbisphenol A
%K SiCP
%K SiCW
%K thermal conductivity composites
%U http://fhclxb.buaa.edu.cn/CN/abstract/abstract13539.shtml