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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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回流次数对in3ag焊料微观组织和剪切性能的影响
Keywords: 金属材料,in3ag焊料,回流次数,微观组织,剪切性能
Abstract:
？用扫描电镜和能量色散仪分别对in3ag焊料焊点基体及其与铜基板界面imc(intermetalliccompound)层的组织结构进行观察和分析,用力学试验机测试焊点的剪切强度,研究了电子封装中回流次数对in3ag焊料微观组织和剪切性能的影响。结果表明：随着回流次数的增加,基体中二次相agin2显著长大,由颗粒状变为长条状,界面imc层(成分为(ag,cu)in2)的厚度线性增加,其生长由界面反应速率和组元扩散速率混合控制,焊点剪切强度呈下降趋势,由1次回流的5.03mpa降到5次回流的2.58mpa;回流1、2、3次后焊点剪切断裂方式均为焊料内部韧性断裂,回流5次后断裂机制转变为韧脆混合断裂。
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