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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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热压温度对c-sic-b_4c复合材料性能的影响
Keywords: 复合材料,c-sic-b_4c,鳞片石墨,热压温度
Abstract:
？用热压烧结法制备c-sic-b_4c复合材料,研究了热压温度对其显微组织和力学性能的影响.结果表明,材料的体积密度、抗折强度和断裂韧性均随着热压温度的升高而提高.在2000℃烧结的复合材料综合力学性能最佳,其体积密度、气孔率、抗折强度和断裂韧性分别达到2.81g/cm~3、2.4%、236.7mpa和5.4mpa·m~(1/2).随着热压温度的提高,材料的组织经历了陶瓷相长大、c相变薄、c相和sic逐渐致密化等过程.利用鳞片石墨c_(fg)易在压力下滑动在陶瓷基体上形成c_(fg)条状组织的特性,实现了材料的显微组织设计.碳陶复合材料的界面结合状态改善、c_(fg)条状结构和c_(fg)与陶瓷相的热膨胀不匹配是材料力学性能提高的主要原因.
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