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交变电流对60nm厚纳米晶铜互连线变形失效行为的影响

Keywords: 金属材料,?交变电流,,纳米晶铜膜,?尺寸效应,?疲劳行为

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Abstract:

?原位观察交变电流作用下纳米晶铜互连线的表面损伤形貌演化过程,重点研究了交变热--机械载荷作用下硅基铜互连线的电致热疲劳性能。结果表明,铜互连线电致热疲劳寿命随着电流密度的增加而减小;载流铜互连线表现出新的变形方式,具有独特的电致热疲劳行为特征。在低电流密度(j<10ma/cm2)条件下,在电致热疲劳中应力控制的晶粒挤出损伤机制起主导作用;而在高电流密度(j>10ma/cm2)条件下,交变电流产生的焦耳热效应起主导作用。

References

[1]  1i.a.blech.electromigrationinthinaluminumfilmsontitaniumnitride,j.appl.phys.,47,1203(1976)
[2]  3c.s.hau–riege.anintroductiontocuelectromigration,microelectron.reliab.,44,195(2004)
[3]  4e.misra,c.marenco,n.d.theodore,t.l.alford,failuremechanismsofsilverandaluminumontitaniumnitrideunderhighcurrentstress,thinsolidfilms,474,235(2005)
[4]  5c.hu.reliabilityphenomenaunderacstress,microelectron.reliab.,38,1(1998)
[5]  6r.m¨onig,r.r.keller,c.a.volkert,thermalfatiguetestingofthinmetalfilms,rev.sci.instrum.,75,4997(2004)
[6]  7r.m¨onig,y.b.park,c.a.volkert,thermalfatigueincopperinterconnects.aipconferenceproceedings,817,147(2006)
[7]  8y.b.park,r.m¨onig,c.a.volkert,thermalfatigueasapossiblefailuremechanismincopperinterconnects,thinsolidfilms,504,321(2006)
[8]  9g.p.zhang,c.a.volkert,r.schwaiger,r.m¨onig,o.kraft,fatigueandthermalfatiguedamageanalysisofthinmetalfilms,microelectron.reliab.,47,2007(2007)
[9]  10j.zhang,j.y.zhang,g.liu,y.zhao,x.d.ding,g.p.zhang,j.sun,unusualthermalfatiguebehaviorsin60nmthickcuinterconnects,scriptamater.,60,228(2009)
[10]  15d.k.kim,w.d.nix,r.p.vincimichael,d.deal,j.d.plummer.studyoftheeffectofgrainboundarymigrationonhillockformationinalthinfilms,j.appl.phys.,90,781(2001)
[11]  20v.yamakov,d.wolf,s.r.phillpot,a.k.mukherjee,h.gleiter,deformationmechanismcrossoverandmechanicalbehaviourinnanocrystallinematerials.philos.mag.lett.,83,385(2003)
[12]  25d.pan,s.kuwano,t.fujita,m.w.chen,ultra–largeroom–temperaturecompressiveplasticityofananocrystallinemetal,nano.lett.,7,2018(2007)
[13]  26x.l.wu,e.ma.mater,dislocationsandtwinsinnanocrystallineniaftersevereplasticdeformation:theeffectsofgrainsize,sci.eng.a.,483-484,84(2008)
[14]  27z.budrovic,h.vanswygenhoven,p.m.derlet,s.vanpetegem,b.schmitt,plasticdeformationwithreversiblepeakbroadeninginnanocrystallinenickel,science,304,273(2004)
[15]  28e.arzt,sizeeffectsinmaterialsduetomicrostructuralanddimensionalconstraints:acomparativereview,actamater.,46,5611(1998)
[16]  29c.x.huang,k.wang,s.d.wu,z.f.zhang,g.y.li,s.x.li,deformationtwinninginpolycrystallinecopperatroomtemperatureandlowstrainrate,actamater.,54,655(2006)
[17]  31t.shimokawa,a.nakatani,h.kitagawa,grain–sizedependenceoftherelationshipbetweenintergranularandintragranulardeformationofnanocrystallinealbymoleculardynamicssimulations,phys.rev.b,71,224110(2005)
[18]  32b.n.kim,k.hiraga,k.morita,viscousgrain–boundaryslidingandgrainrotationaccommodatedbygrain–boundarydiffusion,actamater.,53,1791(2005)
[19]  33k.s.kumar,h.vanswygenhoven,s.suresh,mechanicalbehaviorofnanocrystallinemetalsandalloys,actamater.,51,5743(2003)
[20]  34f.ˇsiˇska,s.forest,p.gumbsch,simulationsofstressstrainheterogeneitiesincopperthinfilms:textureandsubstrateeffects,computationalmaterialsscience,39,137(2007)
[21]  35x.z.liao,f.zhou,e.j.lavernia,s.g.srinivasan,m.i.baskes,d.w.he,y.t.zhu,deformationmechanisminnanocrystallineal:partialdislocationslip,appl.phys.lett.83,632(2003)
[22]  36x.z.liao,f.zhou,e.j.lavernia,d.w.he,y.t.zhu,deformationtwinsinnanocrystallineal,appl.phys.lett.,83,5062(2003)
[23]  37d.chocyk,a.proszynski,g.gladyszewski,diffusionalcreepinducedstressrelaxationinthincufilmsonsilicon,microelectron.eng.,85,2179(2008)
[24]  38s.j.hwang,y.d.lee,y.b.park,j.h.lee,c.o.jeong,y.c.joo,insitustudyofstressrelaxationmechanismsofpurealthinfilmsduringisothermalannealing,scriptamater.,54,1841(2006)
[25]  2h.okabayashi,stress–inducedvoidformationinmetallizationforintegratedcircuits,mater.sci.eng.r,11,191(1993)
[26]  11j.zhang,sizeeffectsonthefatiguebehaviorsinsubmicronthincopperfilms,phddissertation,xi'anjiaotonguniversity,2008
[27]  12e.misra,n.d.theodore,j.w.mayer,t.l.alford,failuremechanismsofpuresilver,purealuminumandsilver–aluminumalloyunderhighcurrentstress,microelectron.reliab.,46,2096(2006)
[28]  13s.j.hwang,j.h.lee,c.o.jeong,y.c.joo,effectoffilmthicknessandannealingtemperatureonhillockdistributionsinpurealfilms,scriptamater.,56,17(2007)
[29]  14s.h.lee,d.kwon,theanalysisofthermalstresseffectonelectromigrationfailuretimeinalalloythin–filminterconnects,thinsolidfilms341(1999)136
[30]  16j.schi?tz,k.w.jacobsen,amaximuminthestrengthofnanocrystallinecopper,science,301,1357(2003)
[31]  17s.p.baker,a.kretschmann,e.arzt,thermomechanicalbehaviorofdifferenttexturecomponentsincuthinfilms,actamater.,49,2145(2001)
[32]  18h.vanswygenhoven,p.m.derlet,a.g.fr?seth.stackingfaultenergiesandslipinnanocrystallinemetals,nat.mater.3,399(2004)
[33]  19g.dehm,s.h.oh,p.gruber,m.legros,f.d.fischer,straincompensationbytwinninginauthinfilms:experimentandmodel,actamater.,55,6659(2007)
[34]  21v.yamakov,d.wolf,s.r.phillpot,a.k.mukherjee,h.gleiter,dislocationprocessesinthedeformationofnanocrystallinealuminiumbymolecular–dynamicssimulation,nat.mater.,1,1(2002)
[35]  22m.w.chen,e.ma,k.j.hemker,h.w.sheng,y.m.wang,x.m.cheng,deformationtwinninginnanocrystallinealuminum,science,300,1275(2003)
[36]  23j.schi?tz,f.d.ditolla,k.w.jacobsen.softeningofnanocrystallinemetalsatverysmallgrainsizes,nature,391,561(1998)
[37]  24z.w.shan,e.a.stach,j.m.k.wiezorek,j.a.knapp,d.m.follstaedt,s.x.mao,grainboundary-mediatedplasticityinnanocrystallinenickel,science,305,654(2004)
[38]  30h.vanswygenhoven,m.spaczer,a.caro,d.farkas,competingplasticdeformationmechanismsinnanophasemetals,phys.rev.b,60,22(1999)

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