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含能材料  2011 

HMX基PBX试件的热安全性及与高分子材料的相容性

DOI: 10.3969/j.issn.1006-9941.2011.06.014

Keywords: 物理化学,高聚物粘结炸药,高分子材料,热安全性,相容性,化学反应性试验

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Abstract:

采用自主研制的化学反应性试验在线检测系统,对HMX基高聚物粘结炸药试件的热安全性及与接触材料(硅泡沫垫层和聚氨酯粘接胶)的相容性进行了研究。结果表明,HMX基高聚物粘结炸药试件有较好的热稳定性。100℃下受热1.15个月的CO2和N2O的逸出量达0.1mL·g-1。与HMX基高聚物粘结炸药试件相比,HMX基高聚物粘结炸药与硅泡沫垫层或聚氨酯粘接胶混合物的N2O的释出量稍有增加,但净增量较小,显示HMX基高聚物粘结炸药试件与两种接触材料是相容的。

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