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铜铁氰自组装多层膜修饰电极的制备及性能

DOI: 10.11830/ISSN.1000-5013.2008.01.0030

Keywords: 铜铁氰化物, 自组装多层膜, 电化学分析, 对苯二酚

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Abstract:

利用层层组装技术,通过Cu2+的桥联作用,制备出铜铁氰自组装膜修饰电极(CuHCF/L-Cys/Au),并研究扫描速度、支持电解质、pH值对该修饰电极电化学性能的影响.结果表明,铜铁氰自组装膜修饰电极具有良好的稳定性和重现性,方法简单易行、干扰小,对对苯二酚具有较好的选择性,其催化电流与对苯二酚浓度在2.0×10-5~2.4×10-4mol.L-1范围呈良好的线性关系.

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