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材料工程  2011 

磁控溅射C靶电流对Cr/C和Cr/C/N复合镀层组织和性能的影响

, PP. 55-59

Keywords: 磁控溅射,C靶电流,Cr/C镀层,Cr/C/N镀层,性能

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Abstract:

利用控溅射技术,通过改变溅射C靶电流工艺参数,在45#钢上制备出Cr/C和Cr/C/N复合镀层。用能谱仪(EDS)、X射线衍射仪(XRD)、扫描电子显微镜(SEM)检测镀层的微观组织;用HX-1000型维氏显微硬度计、球-盘摩擦磨损试验机(POD)、光学显微镜(OM)测试镀层的力学性能。结果表明随C靶电流增加,镀层微观结构都变得更加均匀和致密,硬度在变大,韧性在提高,耐磨性明显提高;所获C电流为1.2A的镀层有优异的摩擦磨损性能;Cr/C/N镀层综合力学性能优于Cr/C镀层。

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