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材料工程  1999 

LOM技术中的挤制陶瓷片的研究

, PP. 32-35

Keywords: 挤出工艺,陶瓷片,分层实体造型

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Abstract:

采用挤出工艺制备了用于LOM技术中的Al2O3和SiC陶瓷片坯件,厚度0.2mm.有机物载体采用低密聚乙烯,固体粉料占48vol%.研究了Al2O3-LDPE混合物的流变性能,对陶瓷片进行了TG-DTA热分析和SEM微观组织分析.

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