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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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SiO2气凝胶结构及其热学特性研究
, PP. 23-25
Keywords: SiO2气凝胶,溶胶-凝胶,超临界干燥,热导率
Abstract:
以正硅酸四乙酯为硅源,通过溶胶-凝胶及超临界干燥过程制备了SiO2气凝胶。用透射电镜、扫描电镜以及孔径分布仪对其结构进行了表征,并用稳态热线法对其热学特性进行了测试。结果表明SiO2气凝胶的孔洞大小分布在5～70nm,峰值在20nm附近,组成网络的胶体颗粒为5～10nm;热学测试结果显示SiO2气凝胶(100kgm-3)的热导率在常温常压下为0.0125Wm-1K-1.
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