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材料工程  2008 

机械合金化制备Cu-Fe过饱和固溶体及其时效分解

, PP. 51-54

Keywords: 机械合金化,过饱和固溶体,时效,硬度,电导率

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Abstract:

采用机械合金化工艺制备Cu-xFe(x=1,2,4,质量分数/%)过饱和固溶体,研究时效对其硬度和导电性能的影响.X-ray衍射分析结果表明机械合金化显著提高了Fe在Cu中的固溶度,Cu-4Fe复合粉末经32h球磨,Fe完全固溶于Cu基体中,此时Cu晶粒尺寸为20nm,点阵常数降低到0.3621nm.硬度和导电率测试结果表明时效处理能促进过饱和固溶体发生分解,Cu-4Fe过饱和固溶体冷压成型压坯在400℃保温8h后显微硬度HV由时效前的175降低到96,电导率由35%IACS(国际退火铜标准)提高到60%IACS.

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