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原位形成氧氮玻璃中间层连接Si3N4陶瓷

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Abstract:

用Si3N4–Al2O3–Y2O3–SiO2混合粉制备用于连接氮化硅陶瓷的焊料,原位形成以氧氮玻璃为中间层的氮化硅陶瓷接头。研究了连接过程中温度、压力及气氛对陶瓷接头微观组织及性能的影响。结果表明在0.1MPa氩气条件下,接头内含有一定量气孔,氮化硅母材有少量分解;氮气气氛、0.1MPa条件下可保证陶瓷母材稳定、接头致密,在氧氮玻璃中间层均匀分布有β-SiAlON陶瓷相;当氮气气压增大到0.5MPa时,陶瓷接头无法实现有效连接。在较低温度下,当连接压力由0.6MPa增大到1.5MPa时,接头弯曲强度提高;升高温度,接头强度出现峰值,在1550℃时达到最高,连接压力对接头的影响减小;继续增大压力将使液相焊料流出,甚至母材自身发生变形。

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