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具有高电流增℃-击穿电压优值的新型应变Si/SiGeHBT

Keywords: 应变Si/SiGeHBT,选择性注入集电区,击穿电压,电流增℃

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Abstract:

为了改善器件的高压大电流处理能力,利用SILVACOTCAD建立了应变Si/SiGeHBT模型,分析了虚拟衬底设计对电流增℃的影响.虚拟衬底可在保持基区-集电区界面应力不变的情况下实现基区Ge组分的高掺杂,进而增大电流增℃.但器件的击穿电压仍然较低,不利于输出功率的提高和系统信噪比的改善.考虑到集电区设计对电流增℃影响不大但与器件击穿电压密切相关,在采用虚拟衬底结构的同时,对器件的集电区进行选择性注入设计.该设计可在集电区引入横向电场,进而提高击穿电压.结果表明:与传统的SiGeHBT相比,新器件的电流增℃和击穿电压均得到显著改善,其优值茁·VCEO改善高达14.2倍,有效拓展了微波功率SiGeHBT的高压大电流工作范围.

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