黄庆安.硅微机械加工技术[M].北京:科学出版社,1996.20-31.HUANG Qing-an. Micro-machine Process Technology Based on Silicon[M]. Beijing: Science Press, 1996. 20-31.(in Chinese)
[2]
AYONA A, ZHANG Xin, TURNERK T. Characterization of silicon wafer bonding for power MEMSapplications[J]. Sensors and Actuators A, 2003, 103: 1-8.
[3]
GOSELE U, TONG Q Y, SCHUMACHER A. Wafer bonding for microsystems technologies[J]. Sensors andActuators, 1999, 74: 161-168.
[4]
MARTIN A. SCHMIDT. Wafer-to-wafer bonding for microstructure formation[J]. Proceedings of the IEEE, 1998,86(8): 1575-1585.
[5]
BARTH P W. Silicon fusion bonding for fabrication of sensors actuators and microstructures[J]. Sensors andActuators A, 1990, 23: 919-926.
北京师范大学,华中师范大学,南京师范大学.无机化学[M].北京:高等教育出版社,1989.292-297.Beijing Normal University, Huazhong Normal University, Nanjing Normal University. Inorganic Chemistry[M]. Beijing: Higher Education Press, 1989. 292-297. (in Chinese)
[8]
周公度.结构化学基础[M].第2版.北京:北京大学出版社,1995.76-80.ZHOU Gong-du. Structure Chemistry[M]. 2nd ed. Beijing: Peking University Press, 1995. 76-80. (in Chinese)
