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掩埋金属自对准工艺对SiGeHBT性能的改善

Keywords: 掩埋金属,自对准,结面积利用率,金属-半导体接触

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Abstract:

为了改善传统的双台面工艺受光刻设备和工艺精度限制这一缺陷,引入了掩埋金属自对准工艺.新工艺使SiGeHBT的制作不受最小光刻条宽的限制,从而有效利用了现有的光刻精度.由此工艺得到的器件测量结果证明,在不提高现有光刻设备精度的基础上,掩埋金属自对准工艺对器件的性能有了改进.

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