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航空学报  2013 

面向壁面剪应力测量的底层隔板微敏感结构设计与制造

DOI: 10.7527/S1000-6893.2013.0052, PP. 963-969

Keywords: MEMS,底层隔板,壁面剪应力,绝缘体上硅,正交实验设计

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Abstract:

采用MEMS技术加工的底层隔板能够为壁面剪应力的测量提供新的手段。利用有限元法(FEM)建模仿真、正交实验设计以及各因素的极差分析,考查了微敏感结构宽度、厚度和凸出壁面高度对底层隔板固有频率和压阻灵敏度的影响规律,完成了底层隔板的结构优化设计。仿真结果显示微敏感结构厚度对隔板固有频率和灵敏度影响最大,提升敏感结构高度能够有效提高压阻灵敏度,固有频率和压阻灵敏度受微敏感结构宽度变化影响很小。基于绝缘体上硅技术,利用电感耦合等离子体刻蚀工艺形成底层隔板结构,反应离子刻蚀工艺完成对敏感结构的释放,所加工底层隔板的整体尺寸为5.9mm×10.1mm×0.39mm。底层隔板的动态特性测试表明样件固有频率为1453.1Hz,与有限元仿真结果的最大偏差为4.4%。

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