|
OALib Journal期刊
ISSN: 2333-9721
费用：99美元
|
|
|
|
倒装焊Sn-Pb焊点的热疲劳失效
, PP. 727-732
Keywords: 倒装焊,底充胶,Sn-Pb焊点,分层,热疲劳
Abstract:
对倒装焊Sn-Pb焊点进行了热循环实验,结合三维全局有限元模拟的结果,研究了Sn-Pb焊点热疲劳失效.结果表明,充胶后焊点内塑性应变范围减小近一个数量级,从而显著降低焊点的疲劳损伤;由于底充胶改变了Sn-Pb焊点应力、应变分布,使得充胶前后焊点裂纹位置发生改变.Sn-Pb焊点热疲劳裂纹萌生于粗化的富Sn相,并穿过富Pb相沿富Sn相生长.Sn和Pb晶粒的非均匀粗化趋势与模拟给出的剪切应变轴向分布一致.
| [1] | Lan J H. IEEE Trans Compon Packag Manuf Technol,1995; 19(4): 7
|
| [2] | Madenci E, Shkarayev S, Mahajan R. J Electron Packag,1998; 120: 336
|
| [3] | Rzepka S, Korhonen M A, Meusel E, Li C-Y. J ElectronPackag, 1998; 120: 342
|
| [4] | Solomon H. IEEE Trans Compon Hybrids Manuf Technol,1986; 9(CHMT): 423
|
| [5] | Nysather J B, Lundstrom P, Liu J H. IEBE Trans Compon Packag Manuf Technol, 1998; 21(2): 281
|
| [6] | Le Gall A O, Jianmin Q, McDowell D L. In: McDowell DL ed., Proc 46th Electronic Components and TechnologyConference, Piscataway NJ: IEEE, 1996: 430
|
| [7] | Lynch J T, Ford M R, Boetti A. IEEE Trans ComponHybrids Manuf Technol,1983; 6(CHMT): 237
|
| [8] | Wild R N. Same Fatigue Properties of Solders cud SolderJoints. IBM Report No.74z00481, 1975
|
| [9] | Frear D, Grivas D, Morris J W. J Electron Mater 1998;17(2): 171
|
| [10] | Zhang Q, Xie X M, Chen L, Wang G Z, Cheng Z N, KempeW. Soldering Surf Mount Technol, 2000; 12(3): 24
|
| [11] | Zhang Q, Xie X M, Chen L, Wang G Z, Cheng Z N. ActaMetall Sin. 2000: 36: 1072
|
| [12] | (张群,谢晓明,陈柳,王国忠,程兆年.金属学报,2000;36:1072)
|
| [13] | Coffin L F. Appl Mech Res, 1962; 1(3): 129
|
| [14] | Doi K, Hirano N, Okada T, Hiruta Y, Sudo T. Int J Microcir Electron Packag, 1998; 119: 231
|
| [15] | Wang G Z, Chen L, Cheng Z N. Chin J Mech Eng, 2000;36(12): 33
|
| [16] | (王国忠,陈柳,程兆年,机械工程学报,2000;36(12):33)
|
Full-Text
|
|
Contact Us
service@oalib.com QQ:3279437679 
WhatsApp +8615387084133
|
|
