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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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喷射沉积制备新型电子封装材料70%Si-Al的研究
, PP. 1277-1279
Keywords: 70%Si-Al合金,电子封装材料,喷射沉积
Abstract:
采用喷射沉积技术制备了新型电子封装材料70%Si-Al合金,对其进行热等静压致密化处理后,测试了合金的主要性能.结果表明喷射沉积70%Si-Al合金的密度低,组织细小均匀,各向同性,Si相粒子尺寸在10-20μm之间且弥散分布.新型70%Si-Al合金具有与Si和GaAs等半导体材料相近的热膨胀系数,热稳定性好,经热等静压后合金的性能进一步提高.喷射沉积70%Si-Al合金具有良好的机械加工性能,可以用作功率芯片、微波电子器件、集成电路块等的封装材料.
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