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金属学报  2008 

3--氨基--1,2,4--三氮唑自组装膜对Cu--Ni合金缓蚀作用及吸附机理研究

, PP. 203-208

Keywords: Cu-Ni合金,ATA,SAMs,缓蚀,吸附

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Abstract:

3-氨基-1,2,4-三氮唑(ATA)是一种环境友好型金属处理剂,以其在Cu-Ni合金表面制备了自组装单分子膜(SAMs),用电化学方法研究ATASAMs对Cu-Ni合金的缓蚀作用及其吸附行为.结果表明,ATA分子易在Cu-Ni合金表面形成稳定的ATASAMs,抑制了Cu-Ni合金的阳极氧化过程,改变了电极表面双电层结构,使零电荷电位负移,固/液界面双电层电容明显降低,有良好的缓蚀效果,这与交流阻抗和极化曲线得到的结论一致.同时研究表明ATA的吸附行为符合Langmuir吸附等温式,吸附机理是典型的化学吸附.

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