软接触电磁连铸的数值模拟和实验分析
, PP. 1112-1116
Keywords: 电磁连铸,软接触,结晶器,数值模拟
Abstract:
结合软接触电磁连铸的准三维场数值模拟和金属Ｓｎ的连铸实验,分析了软接触电磁连铸中结晶器分辨结构和感应圈位置、尺寸、电流对铸坯表面磁通密度.产力和电磁压力的影响.结果表明软接触结晶器中的磁通密度随切缘数的增加而上升,但增幅渐小；铸坯表面在切缝处因微通密度增大而产生纵向凹痕；结晶器的切缝数以１２－２０,切缝宽度以０.５－１.０ｍｍ为宜.
| [1] | Vives C. Metall 7rans, 1989; 20B: 623
|
| [2] | Li T J. Acta Metall Sin, 1997; 33: 524 (李廷举.金属学报,1997;33:524)
|
| [3] | Morishita M.In:Szekly J ed,,Magnetohydrodynamics in Process Metallurgy,California,USA:TMS,1991:267
|
| [4] | CCha P R.ISH Int,1998; 38:403
|
| [5] | Furuhashi S.Tetsu Hagane, 1998; 84 625(Furuhashi S.铁钢, 1998; 84 625)
|
| [6] | Ayata K. CAMP-ISW 1997; 10 828
|
| [7] | Tarapore R D. Metall Trans, 1976; 7B: 343
|
| [8] | Deng K. Trans Nonerrous Met Soc Chin, 1996; 6(2): 12
|
| [9] | Dong H F.J Iron Steel Res, 1998; 10(2): 5 (董华峰. 钢铁研究学报, 1998; 10(2):5
|
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