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OALib Journal期刊
ISSN: 2333-9721
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通过添加POSS颗粒抑制锡基无Pb焊层的晶须生长*
DOI: 10.11900/0412.1961.2014.00495, PP. 685-692
Keywords: 无Pb钎料,晶须生长,硅氧烷齐聚物(POSS)
Abstract:
在Sn,Sn-3.0Ag-0.5Cu和Sn42-Bi58钎料中添加具有纳米结构的笼形硅氧烷齐聚物(POSS)作为增强相,研究了增强相在恒温恒湿(85℃,相对湿度85%)条件下对锡基无Pb焊层晶须生长行为的影响.结果表明,在恒温恒湿条件下,锡基无Pb焊层晶须生长的驱动力是Sn的氧化物生成引起体积膨胀从而对周围焊层产生的压应力;添加POSS可以有效缓解金属Sn的氧化进程,抑制Sn的氧化物生成,从而减缓晶须生长;在Sn,Sn3.0Ag0.5Cu和Sn58Bi焊层中,Sn焊层晶须生长能力最强,Sn58Bi焊层晶须生长能力最弱.
| [1] | Su C H, Chen H, Lee H Y, Wu A T. Appl Phys Lett, 2011; 99: 131906
|
| [2] | Su C H, Chen H, Lee H Y, Liu C Y, Ku C S, Wu A T. J Electron Mater, 2014; 43: 3290
|
| [3] | Tu K N, Chen C, Wu A T. J Mater Sci: Mater Electron, 2007; 18: 269
|
| [4] | He H W, Xu G C, Guo F. Acta Metall Sin, 2009; 45: 744 (何洪文, 徐广臣, 郭 福. 金属学报, 2009; 45: 744)
|
| [5] | Hao H, Shi Y W, Xia Z D, Lei Y P, Guo F, Li X Y. Acta Metall Sin, 2009; 45: 199 (郝 虎, 史耀武, 夏志东, 雷永平, 郭 福, 李晓延. 金属学报, 2009; 45: 199)
|
| [6] | Dimitrovska A, Kovacevic R. J Electron Mater, 2009; 38: 2726
|
| [7] | Suganuma K, Baated A, Kim K S, Hamasakin K, Nemoto N, Nakagawa T, Yamada T. Acta Mater, 2011; 59: 7255
|
| [8] | Horvath B, Shinohara T, Illes B. J Alloys Compd, 2013; 577: 439
|
| [9] | Illes B, Horvath B. J Alloys Compd, 2014; 616: 116
|
| [10] | Jadhav N, Williams M, Pei F, Stafford G, Chason E. J Electron Mater, 2013; 42: 312
|
| [11] | Wu A T, Ding Y C. Microelectron Reliab, 2009; 49: 318
|
| [12] | Boettinger W J, Johnson C E, Bendersky L A, Moon K W, Williams M E, Stafford G R. Acta Mater, 2005; 53: 5033
|
| [13] | Horvath B, Illes B, Shinohara T, Harsanyi G. Thin Solid Films, 2011; 520: 384
|
| [14] | Osenbach J W, Agere S, Allentown P A, DeLucca J M, Potteiger B D, Amin A, Shook R L, Baiocchi F A. IEEE Trans Electron Packag Manuf, 2007; 30: 23
|
| [15] | Nakadaira Y, Jeong S, Shim J, Seo J, Min S, Cho T, Kang S, Oh S. Microelectron Reliab, 2008; 48: 83
|
| [16] | Kim K S, Yu C H, Yang J M. Thin Solid Films, 2006; 504: 350
|
| [17] | Kim K S, Yu C H, Yang J M. Microelectron Reliab, 2006; 46: 1080
|
| [18] | Jo J L, Kim K S, Sugahara T, Nagao S, Hamasaki K, Tsujimoto M, Suganuma K. J Mater Sci: Mater Electron, 2013; 24: 3108
|
| [19] | Hu C C, Tsai Y D, Lin C C, Lee G L, Chen S W, Lee T C, Wen T C. J Alloys Compd, 2009; 472: 121
|
| [20] | Zeng F L, Sun Y, Zhou Y, Li Q K. Trans China Weld Inst, 2010; 31(1): 17 (曾凡林, 孙 毅, 周 玉, 李清坤. 焊接学报, 2010; 31(1): 17)
|
| [21] | Zhang R H, Xu G C, Wang X T, Guo F, Lee A, Subramanian K N. J Electron Mater, 2010; 39: 2513
|
| [22] | Lee A, Subramanian K N. J Electron Mater, 2005; 34: 1400
|
| [23] | Shen J, Peng C F, Yin H G I. J Mater Sci: Mater Electron, 2012; 23: 1640
|
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