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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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快速凝固Cu-Cr合金时效析出的共格强化效应
, PP. 561-564
Keywords: 快速凝固,共格强化效应,铜铬合金
Abstract:
采用单辊快速凝固的方法制备Ｃｕ－Ｃｒ合金微晶薄带,经适当的时效处理,可以在导电率不降低的前提下,显著提高合金的强度和硬度,强度和硬度的提高主要是由晶粒细化和共格弥散析出强化所造成,共格硬化效果与采用Ｇｅｒｏｌｄ公式计算的结果非常接近,与常规固溶处理的Ｃｕ－Ｃｒ合金相比,峰值硬度提高了１．６倍,其中２７％由细晶强化产生.
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