Samsonov G V. The Oxide Handbook. 2nd ed., New York:IFI/Plenum, 1982: 192, 195
[2]
Bhushan B, Theunissen G S A M , Li X D. Thin SolidFilms, 1997; 311: 67
[3]
Zieren V, Jongh M D, Groenou A B V, Zon J B V,Lansinki P, Theunissen G S. IEEE Trans Magn, 1994;30: 340
[4]
Zhang J L, Huang J, Ding C. J Them Spray Technol, 1998;7: 242
[5]
Hones P , Levy F. J Mater Res, 1999; 14: 3629
[6]
Kao A S, Doerner M F, Novotny V J. J Appl Phys, 1989;66: 5315
[7]
Contoux G, Cosset F, Celerier A, Machet J. Thin SolidFilms, 1997; 292: 75
[8]
Wang D Y, Lin J H, Ho W Y. Thin Solid Films, 1998;332: 295
[9]
Bhushan B. Thin Solid Films, 1980; 3: 255
[10]
Bermudez V M, DeSisto W J. J Vac Sci Technol, 2001; 19: 576
[11]
Cheng C S, Gomi H, Sakata H. Phys Status Solidis, 1996; 155: 417
[12]
Abass A K, Jaboori E M. Phys Status Solidis, 1989; 116: K111
[13]
Han L M. Plasma Heat Treatment. Tianjin: Tianjin University Press, 1997: 178(韩立民.等离子热处理.天津:天津大学出版社,1997:178)
[14]
Hong M D. PhD Thesis, Dalian: Dalian University of Technology, 2002(黄美东.大连理工大学博士学位论文, 2002)
[15]
Auciello O, Kelly R. Beam Modification of Materials 1 ?Ion Bombardment Modification of Surfaces. Fundamentals and Application Amsterdam: Elservier Science Publishers, 1984: 56
[16]
Igasaki Y, Mitsuhashi H. Thin Solid Films, 1980; 70: 17
[17]
Hibbs M K, Hohansson B O, Sundgren J E, Helmersson U. Thin Solid Films, 1984; 122: 115a