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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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Al2O3陶瓷的氢致滞后断裂
, PP. 932-934
Keywords: A12O3,封装器件,氢致开裂
Abstract:
Al2O3封装陶瓷在恒载荷下动态充氢能发生氢致滞后断裂,其门槛应力强度因子为KIH=0.71KIc(i=20mA/cm2)及0.45KIc(i=400mA/cm2).氢致开裂区全是沿晶断口,而空拉断口则是沿晶和解理构成的混合断口
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