Wiese S, Feustel F, Meusel E. Sens Actuators, 2002; 99A: 188
[2]
Wiese S, Schubert A, Walter H, Dudek R, Feustel F, Meusel E, Michel B. In: Proceedings IEEE 51th Electronic Components and Technology Conference, Orlando: IEEE, 2001: 890
[3]
Oliver W C, Pharr G M. J Mater Res, 1992; 7: 1564
[4]
Suresh S, Giannakopoulos A E. Acta Mater, 1998; 46: 5755
[5]
Giannakopoulos A E, Suresh S. Scr Mater, 1999; 40: 1191
[6]
Fujiwara M, Otsuka M. Mater Sci Eng, 2001; A319-321: 929
[7]
Ma X, Yoshida F. Appl Phys Lett, 2003; 82: 188
[8]
Zeng K, Tu K N. Mater Sci Eng Rep, 2002; 38: 55
[9]
JIS Z 3198. Test Methods for Lead-Free Solders, Japanese Industrial Standard, 2003
[10]
Stiwell N A, Tabor D. Prog Phys Soc, 1961; 78: 169
[11]
Johnson K L. J Mech Phys Solids, 1970; 18: 115
[12]
Pao Y H, Badgley S, Govila R, Jih E. Mater Res Soc Symp Proc, 1994; 323: 128
[13]
Manson S S. Thermal Stress and Low-Cycle Fatigue. New York: Mcgraw-Hill, 1966
[14]
Villain J, Brueller O S, Qasim T. Sens Actuators, 2002; 99A: 194
