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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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SnCu钎料合金镀层钎焊连接机理及界面反应
, PP. 881-885
Keywords: SnCu钎料合金镀层,连接机理,界面反应
Abstract:
通过在LD31铝合金表面电刷镀Ni,Cu后再沉积SnCu钎料合金镀层的钎焊实验,研究了钎料镀层的连接机理及界面反应.改进了可降低Ni层应力的电刷镀镀Ni液的配方,开发出适合镀层钎焊的SnCu钎料合金镀液.钎焊时钎料润湿为附着润湿.研究了在300℃钎焊时焊缝界面金属间化合物的生长规律,结果表明焊缝中Cu--SnCu界面处生成了球状和棒状的Cu6Sn5金属间化合物;拉伸时焊缝主要沿着SnCu金属间化合物和富Sn相之间的界面断裂.
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