|
OALib Journal期刊
ISSN: 2333-9721
费用：99美元
|
|
|
|
老化对Sn-Ag-Cu焊料/Ni-P镀层界面结构和剪切强度的影响
, PP. 205-210
Keywords: Sn-Ag-Cu焊料,Ni-P镀层,高温老化
Abstract:
对Sn-3.5Ag-0.7Cu/Ni-P界面上的焊点进行了150℃固相老化和250℃液相回流老化实验.两种条件下焊料体内和界面处金属间化合物的成分、长大速率及形貌均有较大差异.在液相回流条件下金属间化合物长大更快,对焊点的可靠性有较大的影响.延长固相老化时间,焊点内生成大尺寸的Ag3Sn相;高温液相回流有Ni3P层生成,降低焊点的焊接强度.
| [1] | Olivier F, Jean C, Jean-Francois S. Composites, 2002; 33A: 1391
|
| [2] | Zeng K, Tu K N. Mater Sci Eng, 2002; R38: 55
|
| [3] | Ho C E, Tsai R Y, Lin Y L. J Electron Mater, 2002; 31: 584
|
| [4] | Sharif A, Islam M N, Chan Y C. Mater Sci Eng, 2004; B113: 184
|
| [5] | Kim K S, Huh S H, Suganuma K. Microelectron Reliab, 2003; 43: 259
|
| [6] | Pang J H L, Low T H, Xiong B S. Thin Solid Films, 2004; 462-463: 370
|
| [7] | Tu K N, Gusak A M, Li M. J Appl Phys, 2003; 93: 1335
|
| [8] | Jang J W, Kim PG,Tu K N. J Appl Phys, 1999; 85: 8456k
|
| [9] | Bath J, Handweker C, Bradley E. Circuits Assem, 2000; 11(5): 30
|
| [10] | Moon K W, Boettinger W J, Kattner U R. J Electron Mater, 2000; 29: 1122
|
| [11] | Tu K N, Zeng K. Mater Sci Eng, 2001; R34: 1
|
| [12] | Shawkret A, Du L G, Sun Z G, Sheng M, Luo L. Acta Metall Sin, 2001; 37: 439(肖克来提，杜黎光，孙志国，盛攻，罗乐．金属学报，2001；37：439)
|
| [13] | He M, Chen Z, Qi G J. Ada Mater, 2004; 52: 2047
|
| [14] | Zeng K, Vuorinen V, Kivilahti J K. IEEE Trans Elec Pack Manuf Technol, 2002; 25: 162
|
| [15] | Won K C, Sung K K, Yoon C S. Proc 53rd Conf on Electronic Components and Technology. New York: IEEE Press, 2003: 1190
|
Full-Text
|
|
Contact Us
service@oalib.com QQ:3279437679 
WhatsApp +8615387084133
|
|
