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金属学报  2009 

电子封装微互连焊点力学行为的尺寸效应

, PP. 422-427

Keywords: 电子封装,微互连焊点,尺寸效应,拉伸强度,约束效应

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Abstract:

研究了微互连模拟焊点在不同直径(d=200---575μm)和长度(l=75---525μm)匹配条件下准静态微拉伸的力学行为.研究结果表明,焊点几何尺度因子$d/l$对焊点内的力学拘束及接头强度有重要影响;d/l增大时导致焊点中力学拘束和应力三轴度的提高,但接头强度并不完全符合Orowan近似公式的预测结果,保持l恒定而增加d时会出现强度变小的尺寸效应.研究结果还表明,无论无铅还是含铅钎料,其焊点拉伸强度与焊点体积(d2l)之间的变化关系符合反比例函数,即σF-Joint=1/(Ad2l+B),焊点的强度随焊点体积的减小而显著增大,显示了焊点“越小越强”的“体积”尺寸效应.

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