|
OALib Journal期刊
ISSN: 2333-9721
费用：99美元
|
|
|
|
Cu/X(X=Cr,Nb)纳米多层膜力/电学性能的尺度依赖性
DOI: 10.3724/SP.J.1037.2011.00246, PP. 1348-1354
Keywords: Cu/Cr,Cu/Nb,纳米多层膜,强度,电阻率,尺寸效应
Abstract:
利用纳米压痕实验以及四探针法,系统研究了相同层厚Cu/X(X=Cr,Nb)纳米金属多层膜的力学性能(强/硬度)和电学性能(电阻率)的尺度依赖性.微观分析表明Cu/X(多层膜调制结构清晰,Cu层沿{111}面择优生长,X(层沿{110}面择优生长.纳米压入结果表明,Cu/X(多层膜的强度依赖于调制周期,并随调制周期的减小而增加.多层膜变形机制在临界调制周期(λc≈25nm)由Cu层内单根位错滑移转变为位错切割界面.多层膜的电阻率不仅与表面/界面以及晶界散射相关,而且在小尺度下受界面条件显著影响.通过修正的FS-MS模型可以量化界面效应对多层膜电阻率的影响.Cu/$X$纳米多层膜可以通过调控微观结构实现强度-电导率的合理匹配.
| [1] | Spearing S M. Acta Mater, 2000; 48: 179
|
| [2] | Suo Z G, Vlassak J, Wagner S. China Particuology, 2005; 3: 321
|
| [3] | Bakonyi I, P′eter L. Prog Mater Sci, 2010; 55: 107
|
| [4] | Was G S, Foecke T. Thin Solid Films, 1996; 286: 1
|
| [5] | Li Y P, Zhang G P. Acta Mater, 2010; 58: 3877
|
| [6] | Wang M, Zhang B, Zhang G P, Yu Q Y, Liu C S. J Mater Sci Technol, 2009; 25: 699
|
| [7] | Misra A, Krug H. Adv Eng Mater, 2001; 3: 217
|
| [8] | Misra A, Hirth J P, Hoagland R G. Acta Mater, 2005; 53: 4817
|
| [9] | Fu E G, Li N, Misra A, Hoagland R G, Wang H, Zhang X. Mater Sci Eng, 2008; A493: 283
|
| [10] | McKeown J, Misra A, Kung H, Hoagland R G, Nastasi M. Scr Mater, 2002; 46: 593
|
| [11] | Liu Y, Bufford D, Wang H, Sun C, Zhang X. Acta Mater, 2011; 59: 1924
|
| [12] | Anderson P M, Li C. Nanostruct Mater, 1995; 5: 349
|
| [13] | Embury J D, Hirth J P. Acta Metall Mater, 1994; 42: 2051
|
| [14] | Phillips M A, Clemens B M, Nix W D. Acta Mater, 2003; 51: 3171
|
| [15] | Koehler J S. Phys Rev, 1970; 2B: 547
|
| [16] | Rao S I, Hazzledine P M. Philos Mag, 2000; 80A: 2011
|
| [17] | Hoagland R G, Kurtz R J, Henager Jr C H. Scr Mater, 2004; 50: 775
|
| [18] | Schroder K, Hollander J. Thin Solid Films, 2004; 458: 322
|
| [19] | Liu H D, Zhao Y P, Ramanath G, Murarka S P, Wang G C. Thin Solid Films, 2001; 384: 151
|
| [20] | Liu M X, Xu K W. J Mater Res, 2008; 23: 1658
|
| [21] | Fuchs K. Proc Cambridge Philos Soc, 1938; 34: 100
|
| [22] | Sondheimer E H. Adv Phys, 2001; 50: 499
|
| [23] | Mayadas A F, Shatzkes M. Phys Rev, 1970; 1B: 1382
|
| [24] | Camacho J M, Oliva A I. Thin Solid Films, 2006; 515: 1881
|
| [25] | Durkan C, Welland M E. Phys Rev, 2000; 61B: 14215
|
| [26] | Jin X, Zhou Y, Kim C O, Lee Y P, Xu H B, Gong S K. J Appl Phys, 2002; 91: 6071
|
| [27] | Namba Y. Jpn J Appl Phys, 1970; 9: 1326
|
| [28] | Michez L A, Hickey B J, Shatz S, Wiser N. Phys Rev, 2004; 70B: 052402
|
| [29] | Oliver W C, Pharr G M. J Mater Res, 1992; 7: 1564
|
| [30] | Deng X, Chawla N, Chawla K K, Koopman M. Acta Mater, 2004; 52: 4291
|
| [31] | Garrido Maneiro M A, Rodr′?guez J. Scr Mater, 2005; 52: 593
|
| [32] | Ma Z S, Long S G, Zhou Y C, Pan Y. Scr Mater, 2008; 59: 195
|
| [33] | Zhang J Y, Zhang X, Liu G, Zhang G J, Sun J. Scr Mater, 2010; 63: 101
|
| [34] | Misra A, Hundley M F, Hristova D, Kung H, Mitchell T E, Nastasi M, Embury J D. J Appl Phys, 1999; 85: 302
|
| [35] | Lima A L, Zhang X, Misra A, Booth C H, Bauer E D, Hundley M F. Thin Solid Films, 2007; 515: 3574
|
| [36] | Lu L, Shen Y F, Chen X H, Qian L H, Lu K. Science, 2004; 304: 422
|
| [37] | Anderoglu O, Misra A, Wang H, Ronning F, Hundley M F, Zhang X. Appl Phys Lett, 2008; 93: 083108
|
Full-Text
|
|
Contact Us
service@oalib.com QQ:3279437679 
WhatsApp +8615387084133
|
|
