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金属学报  2014 

纳米压痕法确定TSV-Cu的应力-应变关系*

DOI: 10.3724/SP.J.1037.2013.00782, PP. 722-726

Keywords: 硅通孔电镀填充铜,纳米压痕,弹性模量,屈服强度,应变强化指数

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Abstract:

为得到硅通孔电镀填充铜(TSV-Cu)的力学性能,对TSV-Cu进行了Berkovich纳米压痕实验.基于Oliver-Pharr算法和连续刚度法确定TSV-Cu的弹性模量和硬度分别为155.47GPa和2.47GPa;采用有限元数值模拟对纳米压痕加载过程进行反演分析,通过对比最大模拟载荷与最大实验载荷,确定TSV-Cu的特征应力和特征应变;由量纲函数确定的应变强化指数为0.4892;将上述实验结果代入幂强化模型中,确定TSV-Cu的屈服强度为47.91MPa.最终确定了TSV-Cu的幂函数型弹塑性应力-应变关系.

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