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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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霉菌对裸铜和镀金处理的印制电路板腐蚀行为的影响
DOI: 10.3724/SP.J.1037.2012.00033, PP. 687-695
Keywords: 霉菌,印制电路板,扫描Kelvin探针,Cu,镀金处理
Abstract:
采用扫描Kelvin探针测试技术研究了裸铜印制电路板(PCB--Cu)和无电镀镍金处理印制电路板(PCB-ENIG)在霉菌作用下的腐蚀行为,通过体视学显微镜、扫描电镜和能谱分析对PCB的腐蚀和霉菌生长情况进行了观察和分析.结果表明,在湿热环境下霉菌在2种材料表面均能良好生长并且数量逐渐增加,28d完成一个生长代谢周期且分生孢子活性良好;84d后试样表面都出现了腐蚀产物,PCB--ENIG腐蚀更为严重.霉菌的生长代谢作用在一定程度上能抑制PCB--Cu表面霉菌生长区域的腐蚀,但是对PCB--ENIG的微孔腐蚀起促进作用.
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