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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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超支化有机硅基聚合物*
, PP. 326-338
Keywords: 超支化硅基聚合物,分子量分布,支化度,端基改性
Abstract:
超支化有机硅基聚合物（HBOSP）是一类新型功能性半有机半无机聚合物，在催化剂载体、陶瓷前驱体、发光材料和耐热材料等领域都有非常广阔的应用前景。本文概述了近10年来利用ABx、A2-Bx或A2-B'Bx-1以及Bf-ABx型单体制备新型结构HBOSP的进展，以及对这类聚合物的分子量及其分布和支化度调控的研究进展；着重总结了近年来针对该类聚合物的端基功能化改性及其应用情况，并在此基础上展望了今后该类聚合物研究的发展趋势。
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