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海洋科学  2005 

铜合金在海水中电化学阻抗谱特征研究

, PP. 21-25

Keywords: 电化学阻抗谱(EIS),铜镍合金,海水,表面膜

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Abstract:

利用电化学阻抗谱(EIS)对紫铜和铜镍合金在静止、洁净海水中表面成膜的过程进行了监测,根据不同阶段的EIS特征建立不同等效电路模型进行拟合分析,获得了铜合金基体及其表面膜层对应的界面电化学信息参数,通过比较3种金属(B10,TUP,B30)表面膜层随时间变化的差异,探讨了合金成分对表面成膜过程的影响。结果表明,浸泡前期B10和TUP的耐蚀性较差,但随着海水中浸泡时间增加,三者的耐蚀能力逐渐接近。TUP的EIS显示了其表面内、外膜层信息,B10表面膜层的成长速度和稳定性均不如B30,反映出合金中镍含量的增多,增加了铜镍合金表面成膜产生钝化的效应。

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