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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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络合剂和添加剂对化学镀铜影响的电化学研究
, PP. 14-19
Keywords: 化学镀铜,络合剂,添加剂,极化,峰电流值
Abstract:
以CuSO4·5H2O作主盐,乙二胺四乙酸二钠盐(Na2EDTA)作主络合剂,三乙醇胺(TEA)作辅助络合剂,2,2′＿联吡啶(dipyridine)作添加剂,组成化学镀铜液体系,研究络合剂、添加剂对该镀液电化学极化性能的影响,并结合化学沉积速率考察TEA和2,2′＿联吡啶对镀液性能的影响.
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