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电化学 2005

陶瓷微细镀覆新技术的研究

, PP. 42-45

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Abstract:

建立微机处理体系(包括线路、图形设计,光照点选择及活化处理等)与化学镀铜相结合的微细镀覆新技术.该技术可在Al2O3基底上获得性能良好的Cu镀层,其布线速率达50mm/s,线分辨率35μm,工艺简便,条件温和,为陶瓷微细镀覆开辟了新途径.

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