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自动化学报 2006
光纤光栅的封装效果对其性能的影响, PP. 999-1007 Keywords: Fiberbragggratingsensor,thermalexpansioncoefficient,lateralforcesensor Abstract: ？Inthispaper,theeffectsofpackagingmaterialandstructureoffiberBragggratingsensorperformanceareinvestigated.TheeffectsofthermalexpansioncoefficientofdifferentembeddingmaterialsonthetemperaturesensitivitiesoftheFBGsensorsarestudiedboththeoreticallyandexperimentallywithgoodagreement,whichprovidesameansforselectionofFBGpackagingmaterialtoachievedesiredtemperaturesensitivity.Wealsodemonstratea4-pointbendingstructuredFBGlateralforcesensorthatmeasuresupto242Nforcewithwell-preservedreflectionspectrum,whereasfor3-pointbendingstructure,multiple-peaksstarttooccurwhenappliedforcereaches72N.
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