%0 Journal Article
%T 光纤光栅的封装效果对其性能的影响
%A 郝建忠
%A 高桥志郎
%A 蔡朝晖
%A 吴俊宏
%A 杨秀峰
%A 陈智浩
%A 吕超
%J 自动化学报
%P 999-1007
%D 2006
%X ？Inthispaper,theeffectsofpackagingmaterialandstructureoffiberBragggratingsensorperformanceareinvestigated.TheeffectsofthermalexpansioncoefficientofdifferentembeddingmaterialsonthetemperaturesensitivitiesoftheFBGsensorsarestudiedboththeoreticallyandexperimentallywithgoodagreement,whichprovidesameansforselectionofFBGpackagingmaterialtoachievedesiredtemperaturesensitivity.Wealsodemonstratea4-pointbendingstructuredFBGlateralforcesensorthatmeasuresupto242Nforcewithwell-preservedreflectionspectrum,whereasfor3-pointbendingstructure,multiple-peaksstarttooccurwhenappliedforcereaches72N.
%K Fiberbragggratingsensor
%K thermalexpansioncoefficient
%K lateralforcesensor
%U http://www.aas.net.cn/CN/abstract/abstract13791.shtml