%0 Journal Article %T 光纤光栅的封装效果对其性能的影响 %A 郝建忠 %A 高桥志郎 %A 蔡朝晖 %A 吴俊宏 %A 杨秀峰 %A 陈智浩 %A 吕超 %J 自动化学报 %P 999-1007 %D 2006 %X ?Inthispaper,theeffectsofpackagingmaterialandstructureoffiberBragggratingsensorperformanceareinvestigated.TheeffectsofthermalexpansioncoefficientofdifferentembeddingmaterialsonthetemperaturesensitivitiesoftheFBGsensorsarestudiedboththeoreticallyandexperimentallywithgoodagreement,whichprovidesameansforselectionofFBGpackagingmaterialtoachievedesiredtemperaturesensitivity.Wealsodemonstratea4-pointbendingstructuredFBGlateralforcesensorthatmeasuresupto242Nforcewithwell-preservedreflectionspectrum,whereasfor3-pointbendingstructure,multiple-peaksstarttooccurwhenappliedforcereaches72N. %K Fiberbragggratingsensor %K thermalexpansioncoefficient %K lateralforcesensor %U http://www.aas.net.cn/CN/abstract/abstract13791.shtml