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科学通报  2011 

多波长激光发射光子集成技术

, PP. 2119-2126

Keywords: 光子集成,激光器,多波长

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Abstract:

针对光子集成芯片设计和制造中所面临的难点,对多波长激光发射光子集成芯片中的多波长激光器阵列、单片集成,芯片模块化耦合封装等核心技术进行了阐述.利用重构等效啁啾技术,二次压印模板技术,大幅度放宽光子集成芯片对制备工艺中的苛刻要求,降低了芯片制造成本;通过端对接耦合技术和铟磷基阵列波导光栅技术,解决了有源无源波导的单片集成问题;建立了多端口分析模型,实现了多参量动态特性的测试,提出了寄生参数补偿的封装技术,大幅度提升了芯片性能.

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