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科学通报  2015 

磁控溅射工艺引起硅表面超薄钝化层电子结构变化

DOI: 10.1360/N972014-01384, PP. 1841-1848

Keywords: 溅射损伤,SiOx/c-Si界面,μ-PCD,有效少子寿命,真空退火,XPS

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Abstract:

通过真空热退火、有效少子寿命(teff)的测量(利用微波光电导衰减μ-PCD法)和表面-界面光电子能谱分析(X-rayPhotoemissionSpectroscopy,XPS)等方法,研究了磁控溅射沉积ITO(IndiumTinOxide)薄膜过程中,等离子体中载能粒子束(原子/离子和紫外辉光)对超薄SiOx(1.5~2.0nm)/c-Si(150μm)样品界面区的原子成键和电子态的损伤问题,并就ITO薄膜的硅表面电子态有效钝化功能进行了研究.结果表明,溅射沉积ITO薄膜材料后该样品的teff衰减了90%以上,从105μs减少到5μs.但是,适当退火条件可以恢复少子寿命到30μs,表明SiOx/c-Si之间界面态的降低有助于改善氧化层的钝化效果.ITO薄膜和c-Si之间SiOx薄层的形成和它的结构随退火温度的变化,是导致界面态、少子寿命变化的主要原因,且得到了XPS深度剖析分析的确认.

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