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Ni、Mn加入量及工艺对PTCR复合材料的性能影响

, PP. 39-43

Keywords: PTCR,复合材料,BaTiO3,PTC,效应,低电阻率

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Abstract:

采用传统固相法工艺,在BaTiO3基材料中加入金属Ni、金属Mn,制备PTCR陶瓷复合材料,以降低其室温电阻率。考查了金属Ni、金属Mn的加入量,以及后期热处理时间和温度对复合材料性能的影响。研究表明:在还原气氛中烧结(1250℃,保温20min),室温电阻率较低,但只有很弱的PTC效应,再通过适当的后期热处理工艺(空气气氛,780℃,保温60min),PTC效应可得到部分恢复。最终获得了具有较低的室温电阻率(ρ25℃=10.2Ω·cm)和较高升阻比(ρmax/ρmin=1.42×103)的PTCR复合材料。

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