In semiconductor manufacturing process, probe
station that is testing equipment is important. Inspection step is for detecting
defects on semiconductor before the packaging. Probe card is a part of probe
station and contains probe tip that contacts to semiconductor. Through probe
tip, it can inspect defects of semiconductor. In this paper, optimization method
is used with response surface analysis to design MEMS type probe tip.
And fabricating probe tip uses maskless lithography, electro-plating and
lapping process.
References
[1]
Ha, S.J., Kim, D.W., Shin, B.C., Cho, M.W. and Han, C.S. (2010) Assessment of Design and Mechanical Characteristics of MEMS Probe Tip with Fine Pitch. Journal of Academia-Industrial Technology, 11, 1210-1215.
[2]
Leslie, B. and Matta, F. (1989) Wafer-Level Testing with a Membrane Probe. IEEE Design & Test of Computers, 6, 10-17.
[3]
Min, C.H. (2007) Fabrication of Vertical Type Probe Card and MEMS Probe Card for Wafer Level Chip Test. Catholic University.
[4]
Kendall, D.L. (1975) On Etching Very Narrow Grooves in Silicon. Appl. Phys. Lett., 26, 195-198.
http://dx.doi.org/10.1063/1.88113
[5]
Kim, I.G. (2004) Study on the Hardness and Internal Stress of Nickel Electro-deposit. Industrial of Telecommunication Information, 47-56.
