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摩擦学学报 2009
Molecular Dynamics Simulation of the Microstructure Evolution of Cu/FeS Composite in Friction under Different Tempertures
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Abstract:
Tribological property of Cu//Cu/FeS tribopair under different temperatures was simulated by molecular dynamics.The tribopair exhibited a low value of friction coefficient at 500K,when there was a severe adhesion wear due to recrystallization of Cu.At 700 K,the number of adhesion layers decreased and friction coefficient increased a little,this is because that FeS structured changed.The simulation proved that FeS experienced two processes of decompose and reunite,and Cu/FeS composite exhibited good tribologi...
