%0 Journal Article
%T Molecular Dynamics Simulation of the Microstructure Evolution of Cu/FeS Composite in Friction under Different Tempertures<br>不同温度下Cu/FeS复合材料摩擦过程中组织演变的分子动力学模拟研究
%A HONG Zhen-Jun
%A CHEN Jing-Chao
%A FENG Jing
%A <br>洪振军
%A 陈敬超
%A 冯晶
%J 摩擦学学报
%D 2009
%I 
%X Tribological property of Cu//Cu/FeS tribopair under different temperatures was simulated by molecular dynamics.The tribopair exhibited a low value of friction coefficient at 500K,when there was a severe adhesion wear due to recrystallization of Cu.At 700 K,the number of adhesion layers decreased and friction coefficient increased a little,this is because that FeS structured changed.The simulation proved that FeS experienced two processes of decompose and reunite,and Cu/FeS composite exhibited good tribologi...
%K composite
%K friction and wear
%K molecular dynamics simulation
%K microstructure evolution
%K friction coefficient
%K layer number of adhesion<br>复合材料
%K 摩擦磨损
%K 分子动力学
%K 组织演变
%K 摩擦系数
%K 黏着层数
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=6E709DC38FA1D09A4B578DD0906875B5B44D4D294832BB8E&cid=5D344E2AD54D14F8&jid=2F467A5C6371C830162AAA01D7DAD07A&aid=2B32818824255F827A476DC2EDF727CD&yid=DE12191FBD62783C&vid=771469D9D58C34FF&iid=CA4FD0336C81A37A&journal_id=1004-0595&journal_name=摩擦学学报&referenced_num=1&reference_num=0