FORMATION OF WHISKER AND HILLOCK IN Cu/Sn-58Bi/Cu SOLDERED JOINT DURING ELECTROMIGRATION
Cu/Sn-58Bi/Cu焊点在电迁移过程中晶须和小丘的生长

With the trends of higher integration and microminiaturization in electronic packaging, the sizes of the soldered joints are becoming smaller and smaller.The corresponding current density in the soldered joints can easily reach 10~3A/cm~2 or higher,which makes the electromigration(EM) much more prominent.EM will lead to the atoms to pile up at the anode side and produce voids or cracks at the cathode side.Furthermore,with the stressing time increasing,these voids or cracks will propagate gradually resulting...