%0 Journal Article
%T FORMATION OF WHISKER AND HILLOCK IN Cu/Sn-58Bi/Cu SOLDERED JOINT DURING ELECTROMIGRATION<br>Cu/Sn-58Bi/Cu焊点在电迁移过程中晶须和小丘的生长
%A HE Hongwen
%A XU Guangchen
%A GUO Fu Beijing University of Technology
%A School of Materials Science
%A Engineering
%A Beijing
%A <br>何洪文
%A 徐广臣
%A 郭福
%J 金属学报
%D 2009
%I 
%X With the trends of higher integration and microminiaturization in electronic packaging, the sizes of the soldered joints are becoming smaller and smaller.The corresponding current density in the soldered joints can easily reach 10~3A/cm~2 or higher,which makes the electromigration(EM) much more prominent.EM will lead to the atoms to pile up at the anode side and produce voids or cracks at the cathode side.Furthermore,with the stressing time increasing,these voids or cracks will propagate gradually resulting...
%K electromigration
%K whisker
%K intermetallics
%K compressive stress
%K Joule heating<br>电迁移
%K 晶须
%K 金属间化合物
%K 压应力
%K Joule热
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=B061E1135F1CBDEE96CD96C109FEAD65&aid=3713D3245B64A94D00D80FB81150FB11&yid=DE12191FBD62783C&vid=94E7F66E6C42FA23&iid=B31275AF3241DB2D&sid=195767709E606C85&eid=0B9C8D3D9D6254B2&journal_id=0412-1961&journal_name=金属学报&referenced_num=1&reference_num=21